Products & Services

Probecards

Our product range comprises both standard probe cards for wafer test as well probe cards for special applications where "off the shelf" probe cards might not suit the needs:

 

Probe cards for automotive- and mixed signal IC

Probe Cards for Automotive- and Mixed Signal IC ‘s  

These applications are characterised by a combination of logic circuitry and power outputs sharing the same die. So also the requirements for wafer test are challenging – high density, fine pitch bond pads for the logic part in combination with hefty currents to be tested going up to several Amps.

A temperature range of our probe cards from – 40 °C to 150 °C allows to cope with the stringent test requirements of ICs for the automotive industry.
     
Probe Cards for Automotive- and Mixed Signal IC ‘s  

SmartClamp” probe protection technology allows safe testing of highest currents up to 100 Amps. For special requirements as contacting over active area (POAA) T.I.P.S. can provide contact geometries that minimise scrub length and pad damage yet maintaining excellent contact properties

 

For detailed information download: Productflyer Automotive Probe Cards (pdf, ca. 690 kB)

Probecards for power semiconductor

Probecards for Power Semiconductor  

Wafer test of power semiconductor poses some quite specific challenges as test currents as high as 100 Amps and test voltages in the range of several Kilovolts.

T.I.P.S.' probe cards for power semiconductors involve several features to cope wit these extreme conditions as:

  • testing under protective atmosphere to avoid high voltage flashovers: "Luftpolster" probe card
  • Protecting probes and D.U.T. from melting due to current overload: "SmartClamp" probe card protection
  • "NoScrub" and "ShortScrub" probe geometries allow minimal scrub mark sizes over active silicon yet maintaining excellent contact properties

A proprietary maintenance process ensures the full performance of the probe card over the life span – either by T.I.P.S. maintenance services or by equipment that can be provided for customer's on-site probe card maintenance.

 

For detailed information download: Productflyer Power Probe Cards (pdf, ca. 400 kB)

Probe cards for sensor devices

Probe Cards for Sensor Devices   Probe Cards for Sensor Devices

 

T.I.P.S. can provide "add-on's" to conventional cantilever probe cards to enable wafer test of sensor ICs, e.g.:

  • pressure sensors: a chip scale pressure chamber allows to exert e.g. air pressure for pressure sensors or other gas atmosphere. The pressure chamber is hovering over the wafer surface creating a micro gap seal and is not touching the wafer surface.
  • probe cards for testing magnetic fields, radioactivity sensors, CMOS imaging sensors etc.

 

For detailed information download: Productflyer Sensor Probe Cards (pdf, ca. 680 kB)

Short scrub/no scrub probe cards for smallest pad dimensions

Short Scrub/No Scrub Probe Cards for smallest Pad Dimensions

Scrub marks on 50 µm diameter bond pads with NoScrub/fine probe card 1)

  

Short Scrub/No Scrub Probe Cards for smallest Pad Dimensions

Parametric probe card for Agilent Tester, Ultra Low Leakage (pA range)

 

Ever decreasing pad sizes for parametric test going together with shrinking scribe line width provide increasing challenges for contacting. On the other hand Pads Over Active Area (POAA) demand small mechanical stress on impact of the probes.

T.I.P.S.' unique probe shape and FEM designed probes allow for minimal scrub mark sizes yet maintaining excellent contact properties

"NoScrub/fine" technology allows for contacting pads as small as 30x30 µm with well proven and economy-priced cantilever probe cards.

 

For detailed information download: Productflyer ShortScrub Probe Cards (pdf, ca. 420 kB)

1) Photo courtesy by NXP Semiconductors

Vertical probe cards

Vertical probe card with "SmartClamp" protected power outputs, dual die configuration

Vertical probe card with "SmartClamp" protected power outputs, dual die configuration

  

Applications characterised by a combination of logic circuitry and power outputs sharing the same die give special challenges for probe cards design and manufacturing – high density, fine pitch bond pads for the logic part in combination with hefty currents to be tested going up to several Amperes.

Quad die vertical probe head and interposer

Quad die vertical probe head and interposer

  

T.I.P.S.' vertical probe cards are specifically developed to address these requirements:

  • Low resistance and high current carrying capability probes.
  • SmartClamp probes protection technology allows safe testing of high test currents and protects probes and D.U.T. from overcurrent spikes.

FEA simulation result of probe and wafer heating in pulsed current application

FEA simulation result of probe and wafer heating in pulsed current application

  
  • Special interposer technology allows for high currents and good signal integrity.
  • Numerical simulation of probe and wafer contact heating enables to define S.O.A.R. (safe operating area) in pulsed and DC high current application.

 

For detailed information download: Productflyer Vertical Probe Cards (pdf, ca. 680 kB)

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